Work

Planar Interconnect Technology for Power Module System Integration

Year: 2012

Type: conference-paper

Authors: Karl Weidner, M. Kaspar, N. Seliger

Institutions: Siemens (Germany), Rosenheim Technical University of Applied Sciences

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1534243973

FWCI: 4.063

Cites: 3

Cited by: 62

Related to: 10