Work

Diffusion, Deformation, and Damage in Lithium-Ion Batteries and Microelectronics

Year: 2014

Type: dissertation

Abstract: This thesis explores mechanical behavior of microelectronic devices and lithium-ion batteries. We first examine electromigration-induced void formation in solder bumps by constructing a theory that couples electromigration and creep. The theory can predict the critical current density below which voids do not form. Due to the effects of creep, this quantity is found to be independent of the solder size and decrease exponentially with increasing temperature, different from existing theories.

Source: Digital Access to Scholarship at Harvard (DASH) (Harvard University)

Author: Matt Pharr

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funders: National Science Foundation, National Defense Science and Engineering Graduate

OpenAlex ID: W1547841226

Cites: 185

Cited by: 1

Related to: 10