Work

Liquid metal cooling in thermal management of computer chips

Year: 2007

Type: article

Source: Frontiers of Energy and Power Engineering in China

DOI: 10.1007/s11708-007-0057-3

Authors: Kunquan Ma, Jing Liu

Institutions: Chinese Academy of Sciences, Technical Institute of Physics and Chemistry

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1548338555

FWCI: 4.182

Cites: 105

Cited by: 194

Related to: 10