Work

Impact of solder fatigue on module lifetime in power cycling tests

Year: 2011

Type: article

Authors: Uwe Scheuermann, Ralf Schmidt

Institution: Semikron (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1551279384

FWCI: 1.084

Cites: 9

Cited by: 29

Related to: 10