Laser-Writing in Silicon for 3D Information Processing
Year: 2014
Type: preprint
Abstract: Micromachining of silicon with lasers is being investigated since the 1970s. So far generating subsurface modifications buried inside the bulk of the silicon without damaging the surface has not resulted in success. Here, we report a method for photo-inducing buried structures in doped silicon wafers with pulsed infrared lasers without modifying the wafer surface. We demonstrate large aspect-ratio, continuous multilevel subsurface structures, with lengths on the millimetre scale, while having sub-micron widths. We further demonstrate spatial information encoding capabilities embedded in subsurface silicon barcodes based on an optical coherence tomography (OCT) readout. The demonstrated silicon processing technology can be used for the realization of multilayered silicon chips, optofluidics and on-chip quantum optics experiments.
Source: arXiv (Cornell University)
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W1555442976