Work

Interfacial adhesion of thin-film patterned interconnect structures

Year: 2004

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2003.1219744

Authors: C. Litteken, R. Dauskardt, T. Scherban, G. Xu, J. Leu, D. Gracias, B. Sun

Institutions: Stanford University, Intel (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1562050697

FWCI: 4.792

Cites: 5

Cited by: 8

Related to: 10