Work

Extended Reliability of substrate solder joints in power modules

Year: 2009

Type: conference-paper

Source: European Conference on Power Electronics and Applications

Authors: Thomas Hunger, Reinhold Bayerer

Institution: Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1578435282

FWCI:

Cites: 3

Cited by: 3

Related to: 10