Work

Multi-component hot embossing of micro- and nanosystems

Year: 2011

Type: conference-paper

Source: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Authors: Alexander Kolew, Markus Heilig, Karsten Sikora, Daniel Münch, Matthias Worgull

Institution: Karlsruhe Institute of Technology

Language: English

Topic: Injection Molding Process and Properties

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1584122297

FWCI:

Cites: 4

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Related to: 10