Work

Analytical calculation and direct measurement of stress in an aluminum interconnect of very large scale integration

Year: 1992

Type: conference-paper

Source: AIP conference proceedings

DOI: 10.1063/1.42693

Authors: H. Yagi, H. Niwa, T. Hosoda, M. Inoue, H. Tsuchikawa, Masaharu Kato

Institutions: Fujitsu (Japan), Tokyo Institute of Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1596149796

FWCI:

Cites:

Cited by: 1

Related to: 10