Work

Reliability and characterization of dielectric layers used for leaded and lead-free solder application

Year: 2004

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2003.1271586

Authors: Wei-Chung Lo, Yu-Chih Chen, Yu-Fang Chen, Huan-Chun Fu, Shu-Ming Chang, Li-Cheng Shen, Hsu-Tien Hu, Kuo-Chuan Chen

Institution: Industrial Technology Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1600641876

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Cites: 5

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Related to: 10