Work

Optimization of Electrode Material and Connecting Process for Mg-Si-Sn Based Thermoelectric Device

Year: 2015

Type: article

Abstract: Metal (Ni, Cu, Ag, Al) electrode was connected with Mg-Si-Sn based thermoelectric materials by Spark Plasma Sintering (SPS) process.Microstructure of interface, sintering process and transport properties, including electrical conductivity, thermal conductivity and thermal expansion coefficient, of electrode materials were investigated.The results showed that composites of Ni-Al /Al (60:40) and Cu-Al/Cu (45:55) displayed high electrical conductivity, high thermal conductivity and suitable thermal expansion coefficient to Mg-Si-Sn based materials.It is indicated that the two composites have potential to be used as good electrode materials for, and to be connected by SPS sintering to, Mg-Si-Sn based materials.

Source: Journal of Inorganic Materials

DOI: 10.15541/jim20140623

Authors: CHEN Geng, LIU Tao-Xiang, TANG Xin-Feng, SU Xian-Li, YAN Yong-Gao

Institution: Wuhan University of Technology

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

Funders: National Natural Science Foundation of China, Higher Education Discipline Innovation Project, National Key Research and Development Program of China