Work

Thin-film adhesion measurement by laser-induced stress waves

Year: 2002

Type: report

Abstract: Based on the theoretical and experimental parametric study results, the planar tensile sample geometry is modified to a triangular prism so that a high strain rate shear wave is generated and then allowed to impinge upon the test film. By allowing the initial longitudinal wave to mode convert to a shear wave and a secondary longitudinal wave at the oblique surface, mixed-mode loading of the thin film interface is realized. Film failure under mixed-mode conditions is observed and the mixed-mode interfacial strength is measured and compared with the tensile case.

Source: Illinois Digital Environment for Access to Learning and Scholarship (University of Illinois at Urbana-Champaign)

Author: Junlan Wang

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funders: National Science Foundation, University of Illinois at Urbana-Champaign, Division of Materials Research, Campus Research Board

OpenAlex ID: W1632035847

Cites: 118

Cited by: 25

Related to: 10