Challenges with manufacturability of package on package (PoP)
Year: 2013
Type: article
Authors: Petri Savolainen, Craig Hillman, Cheryl Tulkoff, Greg Caswell
Institution: DfR Solutions (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1669786280