Work

Isothermal wafer-level electromigration test for the characterization of metal system reliability monitoring

Year: 2002

Type: conference-paper

Source: International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

DOI: 10.1109/vtsa.2001.934538

Authors: C.K. Kuo, H.C. Yuan, S.C. Lee, S.Y. Lee, L.H. Chu, R.Y. Shiue, J.T. Yue

Institution: Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1670570095

FWCI:

Cites:

Cited by: 4

Related to: 10