Work

High performance isotropic polymer/metal composite for interconnect applications

Year: 2002

Type: conference-paper

Source: Japan International Electronic Manufacturing Technology Symposium (IEMT)

DOI: 10.1109/iemt.1995.541077

Authors: R.F. Saraf, J.M. Roldan, C.J. Sambucetti, M.A. Gaynes, R. Lewis

Institutions: IBM (United States), IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1745967590

FWCI: 0.356

Cites: 1

Cited by: 1

Related to: 10