Work

A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Year: 1987

Type: article

Abstract: This paper presents an extensive literature review and assessment of corrosion failure mechanisms encountered during accelerated tests of microelectronic devices. The failure mechanism of primary emphasis is electrolytic metal migration. The metallurgies of interest are silver, gold, copper, and aluminum. Electrochemical investigations of dendritic growth are also reviewed. Mechanistic results from the electrochemical investigations are discussed in light of the empirical results of accelerated tests.

Source: Journal of The Electrochemical Society

DOI: 10.1149/1.2100401

Authors: J. J. Steppan, J. A. Roth, L. C. Hall, D. A. Jeannotte, S. P. Carbone

Institutions: IBM (United States), Vanderbilt University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

Funder: Vanderbilt University

OpenAlex ID: W1775659229

FWCI: 4.091

Cites:

Cited by: 131

Related to: 10