Work

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Year: 2009

Type: article

Source: Chalmers Publication Library (Chalmers University of Technology)

Authors: Nabiollahi, Nabi, Liu, Johan, Hu, Zhili, Zhang, Yan, Yue, Cong, Cheng, Zhaonian, Inoue, Masahiro

Institutions: Chalmers University of Technology, Shanghai University, The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1796607950

FWCI:

Cites: 6

Cited by:

Related to: 10