Work

Packaging test chip for flip-chip and wire bonding process characterization

Year: 2004

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/sensor.2003.1215348

Authors: J. Schwizer, Wan Ho Song, M. Mayer, O. Brand, H. Baltes

Institutions: ETH Zurich, Georgia Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Kommission für Technologie und Innovation

OpenAlex ID: W1821988358

FWCI: 3.308

Cites: 5

Cited by: 14

Related to: 10