Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure
Year: 2015
Type: article
Source: Journal of Materials Chemistry C
DOI: 10.1039/c5tc01723h
Authors: Yong Wei, Song Chen, Yong Lin, Zimei Yang, Lan Liu
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1825450084