Work

New assembly and interconnect technologies for power modules

Year: 2012

Type: conference-paper

Authors: Karsten Guth, N. Oeschler, L. Boewer, R. Speckels, G. Strotmann, Nicolas Heuck, S. Krasel, A. Ciliox

Institution: Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1844262866

FWCI: 8.938

Cites: 4

Cited by: 54

Related to: 10