Work

A novel procedure for failure criteria determination at solder joints under the board level drop test

Year: 2015

Type: article

Source: Materials Testing

DOI: 10.3139/120.110750

Authors: Jian Gu, Yongping Lei, Jian Lin, Guichen Wen, Hanguang Fu

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1895055688

FWCI: 0.322

Cites: 20

Cited by: 4

Related to: 10