In-situ Bond Wire and Solder Layer Health Monitoring Circuit for IGBT Power Modules
Year: 2012
Type: conference-paper
Authors: Bing Ji, Volker Pickert, Bashar Zahawi
Institution: Newcastle University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1900405090