Work

Future military avionics applications of wafer-scale technology

Year: 2003

Type: conference-paper

Abstract: Wafer-scale integration (WSI) technology has the potential to improve avionics system reliability substantially and enable the development of airborne-compatible supercomputers for real-time machine intelligence and new forms of sensor integration. Companion technologies in the areas of advanced packaging, cooling and photonics will need to be integrated with WSI in order to achieve these goals. The potential use of flyable wafer-based supercomputers for extremely high throughput applications is described. These applications and associated processing requirements are also described.>

Source: International Conference on Wafer Scale Integration (ICWSI)

DOI: 10.1109/wafer.1989.47530

Authors: R. Morgan, M. Soraya

Institutions: Wright-Patterson Air Force Base, Wright Research and Development Center

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W1912789059

FWCI: 0.432

Cites: 2

Cited by: 6

Related to: 10