Work

Copper post-CMP brush cleaning

Year: 2003

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.1999.787084

Authors: N. Elbel, Shumin Wang, A. Sanger, D. Hadawi, C. Held

Institution: Siemens (Germany)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1920029654

FWCI:

Cites: 3

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Related to: 10