Work

Polymer/metal composite for interconnection technology

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1995.517820

Authors: R.F. Saraf, J.M. Roldan, R. Jagannathan, C. Sambucetti, J. Marino, C. Jahnes

Institution: IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1948230016

FWCI: 2.134

Cites: 5

Cited by: 15

Related to: 10