Work

The next generation intigrated MEMS and CMOS process on SOI wafers for overdamped accelerometers

Year: 2005

Type: conference-paper

Source: International Conference on Solid-State Sensors, Actuators and Microsystems

DOI: 10.1109/sensor.2005.1497273

Authors: T.D. Chen, T.W. Kelly, D. Collins, D. Bain, B. Berthold, T.J. Brosnihan, T. Denison, J. Kuang, M. O'Kane, J.W. Weigold

Institutions: Analog Devices (United States), Analog Devices (Ireland)

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1950918060

FWCI: 3.849

Cites: 7

Cited by: 29

Related to: 10