Work

Advanced Materials for Thermal Management of Electronic Packaging

Year: 2011

Type: book

Source: Springer series in advanced microelectronics

DOI: 10.1007/978-1-4419-7759-5

Author: Xingcun Colin Tong

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W195822438

FWCI: 5.528

Cites: 3

Cited by: 322

Related to: 10

Parts: 12