Work

Electrodeposited Micro Copper Bumps for Packaging Module of a Micro-Thermoelectric Cooler

Year: 2008

Type: conference-paper

Source: ASME Summer Bioengineering Conference (SBC)

DOI: 10.1115/sbc2008-192588

Authors: Ajay A. Kardak, Elizabeth J. Podlaha-Murphy, Michael C. Murphy, Ram V. Devireddy

Institutions: Louisiana State University, Northeastern University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1967620368

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