Bonding characteristics during very high power ultrasonic additive manufacturing of copper
Year: 2010
Type: article
Source: Scripta Materialia
Authors: M.R. Sriraman, S.S. Babu, M. Short
Institutions: The Ohio State University, Edison Welding Institute
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1971822367
