Work

Study of the intermetallic growth in copper-clad aluminum wires after thermal aging

Year: 2014

Type: article

Source: Intermetallics

DOI: 10.1016/j.intermet.2014.02.007

Authors: Antoine Gueydan, Bernadette Domengès, Eric Hug

Institutions: Centre National de la Recherche Scientifique, École Nationale Supérieure d'Ingénieurs de Caen, Laboratoire de Cristallographie et Sciences des Matériaux

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Association Nationale de la Recherche et de la Technologie

OpenAlex ID: W1972642585

FWCI: 2.933

Cites: 48

Cited by: 92

Related to: 10