Fluxless Wafer Bonding in Vacuum Using Electroplated Sn–Ag Layers
Year: 2007
Type: article
Authors: Pinjan Wang, Jong Sung Kim, Chin C. Lee
Institution: University of California, Irvine
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1975464965