Year: 2010
Type: conference-paper
Abstract: AlCu sputtering is widely used for IC BEOL interconnection. In manufacturing, wafer sticking is a major issue, which serious impacts the mean-time-between-fail (MTBF) of AlCu sputtering system. Also, during high power plasma sputtering, wafers can be easily stuck onto the chamber process kits, which leads to the yield loss or even wafer scrap. This paper studies the factors of wafer sticking and summarizes the methods including process and hardware optimization to improve MTBF by reducing the wafer sticking hit rate.
Source: ECS Transactions
DOI: 10.1149/1.3360710
Authors: Xuan Wang, Xiu-jun Li, Xia Li, Yong-qiang Wu, Chi-Hsien Peng, Jiwei Zhang, Huang-Her Yang, Paul-Chang Lin, Wen-Pin Chiu, Cheng Xing
Institution: Semiconductor Manufacturing International (China)
Language: English
Field: Materials Science
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W1975549422