Hybrid memory cube new DRAM architecture increases density and performance
Year: 2012
Type: conference-paper
Source: Symposium on VLSI Technology
Authors: Joe Jeddeloh, Brent Keeth
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1981220134