Work

Measurements of stress during vapor deposition of copper and silver thin films and multilayers

Year: 1996

Type: article

Source: Journal of Applied Physics

DOI: 10.1063/1.363701

Authors: Alison L. Shull, Frans Spaepen

Institution: Harvard University

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, Harvard University, Division of Materials Research

OpenAlex ID: W1982181644

FWCI: 8.792

Cites: 45

Cited by: 236

Related to: 10