Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper‐clad laminates
Year: 2007
Type: article
Source: Polymer International
DOI: 10.1002/pi.2359
Institutions: Yonsei University, Louisiana State University
Language: English
Subfield: Polymers and Plastics
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1982870538