Work

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

Year: 2003

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2003-35170

Authors: Patrick W. Wilkerson, Andrzej J. Przekwas, Chung-Lung Chen

Institution: CFD Research Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1983207142

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