Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Year: 2005
Type: article
Source: Journal of Electronic Materials
Institutions: Georgia Institute of Technology, Engi-Mat (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Georgia Institute of Technology
OpenAlex ID: W1985878185