Microstructural characterization of Al/Mg alloy interdiffusion mechanism during Accumulative Roll Bonding
Year: 2007
Type: article
DOI: 10.1007/bf03027805
Authors: Ming-Che Chen, Chih-Chun Hsieh, Weite Wu
Institution: National Chung Hsing University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Council
OpenAlex ID: W1985925324
