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Lead-Free Flip-Chip Packaging Affects on Ultralow-$k$ Chip Delamination

Year: 2012

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2012.2193880

Authors: Kuo Ming Chen, Yunn Horng Guu, Tsung Shu Lin

Institutions: National United University, United Microelectronics (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1989450993

FWCI:

Cites: 10

Cited by: 3

Related to: 10