Substrate interconnect technologies for 3-D MEMS packaging
Year: 2005
Type: article
Source: Microelectronic Engineering
Authors: Brian Morgan, Xuefeng Hua, Tomohiro Iguchi, Taizo Tomioka, Gottlieb S. Oehrlein, Reza Ghodssi
Institutions: University of Maryland, College Park, Toshiba (Japan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1989458708