Work

Experimental and Numerical Analysis of Thermal Deformation in Thermoelectric Coolers

Year: 2011

Type: article

Abstract: In this paper, the electronic speckle pattern interferometry (ESPI) and the finite element method (FEM) were used to obtain the thermal deformation induced in a centrally supported thermoelectric cooler (TEC). The results of ESPI and FEM are in good agreement and show that the warpage varies linearly with respect to the temperature difference between the two ceramic plates inside the TEC.

Source: Applied Mechanics and Materials

DOI: 10.4028/www.scientific.net/amm.70.399

Authors: Wei Chung Wang, Ting Ying Wu

Institution: National Tsing Hua University

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: hybrid

OpenAlex ID: W1990188205

FWCI:

Cites: 1

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Related to: 10