Work

Polymer integration for packaging of implantable sensors

Year: 2014

Type: article

Source: Sensors and Actuators B Chemical

DOI: 10.1016/j.snb.2014.05.063

Authors: Yiheng Qin, Matiar M.R. Howlader, M. Jamal Deen, Yaser M. Haddara, P. Ravi Selvaganapathy

Institution: McMaster University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Good health and well-being

Open Access status: closed

OpenAlex ID: W1993982884

FWCI: 8.919

Cites: 390

Cited by: 169

Related to: 10