Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging
Year: 2006
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.2429707
Institution: Hong Kong University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W1994450646