Work

Reliability of Planar SKiN Interconnect Technology

Year: 2012

Type: conference-paper

Author: Uwe Scheuermann

Institution: Semikron (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1995406154

FWCI: 2.438

Cites: 7

Cited by: 32

Related to: 10