Year: 2012
Type: article
Abstract: Bi-Sb alloys were grown by means of an electrodeposition method using Cu electrodes. The alloys were studied with the help of an x-ray diffractometer and an electron probe microanalysis. The both investigations have shown no trace of Cu in the obtained alloys. It can be concluded that Cu electrodes can be used for the deposition of Bi-Sb alloys; which results in an advantage of availability of the electrode.
Authors: Masato Ohmukai, Akira Tsuyoshi
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W1996195810
