Work

Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe

Year: 2005

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2005-73393

Authors: Brian V. Borgmeyer, H. B. Ma

Institution: University of Missouri

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1997884573

FWCI: 2.135

Cites:

Cited by: 4

Related to: 10