Work

Online Fault Tolerance Technique for TSV-Based 3-D-IC

Year: 2014

Type: article

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems

DOI: 10.1109/tvlsi.2014.2343156

Authors: Yi Zhao, Saqib Khursheed, Bashir M. Al-Hashimi

Institutions: University of Southampton, University of Liverpool

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Engineering and Physical Sciences Research Council

Awards: G5747769951, G6282963897, Resilient and Testable Energy-Efficient Digital Hardware

OpenAlex ID: W1998234398

FWCI: 1.237

Cites: 26

Cited by: 42

Related to: 10