Work

An overview of through-silicon-via technology and manufacturing challenges

Year: 2015

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2014.10.019

Authors: Jeffrey P. Gambino, Shawn A. Adderly, John U. Knickerbocker

Institution: IBM (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1998290008

FWCI: 10.07

Cites: 218

Cited by: 326

Related to: 10