Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
Work
Year: 2009
Type: article
Authors Tz-Cheng Chiu, Hsun-Chia Lin
Institution National Cheng Kung University
Cites: 38
Cited by: 36
Related to: 10
FWCI: 1.886
Citation percentile (by year/subfield): 93.83
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: closed