Year: 2004
Type: article
Abstract: Neutral atoms can be trapped and manipulated with surface mounted microscopic current carrying and charged structures. We present a lithographic fabrication process for such atom chips based on evaporated metal films. The size limit of this process is below 1 μm. At room temperature, thin wires can carry current densities of more than 107A∕cm2 and voltages of more than 500 V. Extensive test measurements for different substrates and metal thicknesses (up to 5 μm) are compared to models for the heating characteristics of the microscopic wires. Among the materials tested, we find that Si is the best suited substrate for atom chips.
Source: Applied Physics Letters
DOI: 10.1063/1.1804601
Authors: S. Groth, P. Krüger, S. Wildermuth, R. Folman, T. Fernholz, J. Schmiedmayer, D. Mahalu, I. Bar-Joseph
Institutions: Heidelberg University, Weizmann Institute of Science
Language: English
Subfield: Atomic and Molecular Physics, and Optics
Field: Physics and Astronomy
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2002415290